Product Overview
This intelligent inspection equipment for the appearance of FPC (Flexible Printed Circuit) boards is equipped with multi-specification line scan cameras (5μm/10μm/15μm) that can be flexibly configured to achieve precise imaging of micron-level defects.
By integrating proprietary multi-dimensional optical imaging, AI deep learning, and AVI visual inspection technologies, an integrated intelligent inspection system is constructed.
Supports quick import and use of standard templates, enabling rapid switching of FPC products, shortening changeover time, and improving production line adaptability.
Supports simultaneous inspection of both sides of FPC, balancing inspection accuracy and efficiency to meet the quality inspection needs of large-scale production.
By integrating proprietary multi-dimensional optical imaging, AI deep learning, and AVI visual inspection technologies, an integrated intelligent inspection system is constructed.
Supports quick import and use of standard templates, enabling rapid switching of FPC products, shortening changeover time, and improving production line adaptability.
Supports simultaneous inspection of both sides of FPC, balancing inspection accuracy and efficiency to meet the quality inspection needs of large-scale production.
Product Advantages
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- Improving the imaging quality of weak contrast defects
- Customized high-efficiency illumination imaging overcomes common defects such as creases, coating discoloration, and foreign matter under the film, improving the imaging quality of weak contrast defects.
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- The generalization ability of large models is strong
- Large models trained with industrial big data have strong generalization capabilities and can be quickly iterated to adapt to new processes and defects.
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- Improving equipment uptime
- Gerber drawings are intelligently imported and automatically matched with parameters, reducing the amount of changeover and debugging and improving equipment uptime.
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- Achieve precise positioning
- High-precision contour feature extraction enables accurate positioning of tiny/complex components.
Equipment Parameters
Parameters
Information and Data
Maximum supported product size
300*500
Image acquisition scanning field of view ( line scan )
80mm
Pixel precision
| 10um | 5um |
Product dimensions ( mm )
| 60*80 | 280*380 | 60*80 | 280*380 |
Scan time
| 8S | 15S | 9S | 22S |
Equipment size
L: 2300mm * W: 2400mm * H: 2200mm, Weight: 3200kg
Cleanliness level
Class 10,000 cleanroom for the whole equipment
Applicable products
FPC bare board overall appearance inspection
Testing items
Foreign matter defects under the film, creases, scratches, gold oxide, circuit appearance, protective film, character defects, solder resist ink, plating color defects, shape defects, poor PI reinforcement, EMI defects, steel sheet defects, FR4 defects, inkjet printing defects, film residue, and die-cutting defects.
Process Application
Defect Display
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Exposed copper
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Oxidation
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Creases
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Poor protective film
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Submembrane foreign body
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EMI poor
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Dirt and oil stains
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Scars
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Minor scratches
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Slight creases
