TGV (Through Glass Via) technology is a crucial pathway for glass substrates in advanced packaging, high-density interconnects, and novel optoelectronic integration. This equipment primarily addresses the quality inspection needs of glass wafers during through-hole fabrication, post-hole cleaning, metallization, and subsequent interconnect processes. It can perform high-precision detection and analysis of through-hole diameter, hole position deviation, roundness, taper, sidewall morphology, cracks and edge chipping, residual contamination, internal defects, and metallization anomalies, providing reliable quality assurance for subsequent seed layer deposition, electroplating filling, RDL fabrication, and packaging interconnects.
By implementing inspections at key process nodes in TGV, the risks of via defects, interconnect failures, and package reliability can be effectively reduced, thereby improving product yield and process stability.